描述
ZCORE Chip
technology change the future
Chip details
BC847BV_2
Epitaxial Die Construction Complementary PNP Type Available (BC857BV) Ultra-Small Surface Mount Package

VCEO(V) :45
IC(mA) :100
hFE(Min):200
hFE(Max):450

VCEO(V) :45
IC(mA) :100
hFE(Min):200
hFE(Max):450